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خونه > محصولات > ایستگاه بازکاری نیمه اتوماتیک BGA > Automatic Infrared BGA Rework Station with Digital LCD Display and Automatic Feeding for Mobile Phone IC Repair

Automatic Infrared BGA Rework Station with Digital LCD Display and Automatic Feeding for Mobile Phone IC Repair

جزئیات محصول

محل منبع: چین

نام تجاری: WISDOMSHOW

گواهی: CE ISO FDA

شماره مدل: WDS-880D/680D

سند: بروشور محصول PDF

شرایط پرداخت و حمل و نقل

بهترین قیمت رو بدست بیار
برجسته کردن:

Automatic Feeding BGA Rework Station,Infrared Heating BGA Repair Machine,Digital LCD Display BGA Reballing Machine

,

Infrared Heating BGA Repair Machine

,

Digital LCD Display BGA Reballing Machine

ابعاد:
450mm x 350mm x 300mm
اجزای اصلی:
PLC
اندازه چیپس کت و شلوار:
1 * 1 ~ 120 * 120 میلی متر
ولتاژ:
AC 220V
حداکثر بار نصب:
150 گرم
مصرف برق:
800W
فعلی:
50/60 هرتز
تابع:
دستگاه تغذیه اتوماتیک
نمایش:
صفحه نمایش LCD دیجیتال
اندازه کوچک PCB:
W10*D10mm
اندازه تراشه قابل اجرا:
حداکثر 80*80 میلی متر حداقل 0.8 * 0.8 میلی متر
رابط درجه حرارت دما:
1 عدد
قدرت بخاری بالایی:
حداکثر 1200 وات
گرمایش:
3 منطقه گرمایش مستقل
منبع تغذیه AC:
Ac 220v ± 10%، 50/60Hz
ابعاد:
450mm x 350mm x 300mm
اجزای اصلی:
PLC
اندازه چیپس کت و شلوار:
1 * 1 ~ 120 * 120 میلی متر
ولتاژ:
AC 220V
حداکثر بار نصب:
150 گرم
مصرف برق:
800W
فعلی:
50/60 هرتز
تابع:
دستگاه تغذیه اتوماتیک
نمایش:
صفحه نمایش LCD دیجیتال
اندازه کوچک PCB:
W10*D10mm
اندازه تراشه قابل اجرا:
حداکثر 80*80 میلی متر حداقل 0.8 * 0.8 میلی متر
رابط درجه حرارت دما:
1 عدد
قدرت بخاری بالایی:
حداکثر 1200 وات
گرمایش:
3 منطقه گرمایش مستقل
منبع تغذیه AC:
Ac 220v ± 10%، 50/60Hz
Automatic Infrared BGA Rework Station with Digital LCD Display and Automatic Feeding for Mobile Phone IC Repair
Automatic Infrared BGA Rework Station for Mobile Phone IC Repair
WDS-880D Main Features
Integrated hot air head and mounting head design with automatic mounting, welding, and dismantling functions
Upper air head features rapid heating system with uniform temperature distribution and fast cooling (50-80°C cooling capability), ideal for lead-free soldering processes
Lower heating zone utilizes infrared + hot air hybrid technology for fast PCB warm-up (10°C/S rate) with maintained temperature uniformity
Three independent temperature zones (upper, lower, and infrared preheating) with synchronized automatic movement
Motor-controlled lower temperature zone with vertical movement for PCB support
High-precision slider system ensures accurate BGA and PCB board placement
Original bottom preheating platform with German imported infrared gold-plated light tubes and anti-glare thermostatic glass (1800°C temperature resistance)
500 × 420mm preheating area with movable platform, clamping device, and cooling system in X-direction
Motor-controlled X,Y axis movement for fast alignment and efficient space utilization
Maximum clamping plate size of 590 × 400mm with no rework dead ends
Dual joystick control with alignment lens and heating platform for precision alignment
Built-in vacuum pump with φ angle rotation and precision fine-tuning mounting nozzle
Automatic suction and mounting height recognition with 10-gram pressure control and 0-pressure functions for smaller chips
Color optical vision system with manual X,Y movement, spectral dual-color, magnification, and fine-tuning capabilities
Chromatic aberration resolution device with auto-focus and software operation for BGA sizes up to 80 × 80mm
Various alloy hot air nozzles with 360° rotation positioning
Four temperature measurement ports for multi-point real-time monitoring and analysis
Solid-state operation display for safe and reliable temperature control
Automatic generation of SMT standard temperature disassembly curves for different environmental conditions
Optional camera for observing tin ball melting points during the soldering process
WDS-680D Technical Specifications
Parameter Specification
Total Power 6000W
Upper Heating Power 1600W
Lower Heating Power 1600W
Infrared Heating Power 4000W Total IR Power
Power Supply Two-phase 220V, 50/60Hz
Positioning Method V-slot PCB fixing, laser positioning, motor-controlled X,Y axis
Temperature Control High-precision K-type thermocouple closed loop control (±1°C accuracy)
Electrical Selection PC control system, temperature control module, motion control board, Panasonic servo, stepper drive
Tin Spot Monitoring External camera for monitoring tin ball melting process (optional)
MES System Reserved MES port
Feeding Device Automatic feeding device
Maximum PCB Size 590 × 400mm
Minimum PCB Size 10 × 10mm
Temperature Measurement Interface 4 ports
Chip Zoom Range 2 to 80 times
PCB Thickness 0.5-10mm
Applicable Chip Size 0.8 × 0.8 to 90 × 90mm
Minimum Chip Pitch 0.15mm
Maximum Mounting Load 500g
Mounting Accuracy ±0.01mm
Overall Dimensions 820 × 706 × 1400mm
Machine Weight Approximately 200KG
Other Features Dual joystick operation, automatic & manual mode switching, 7-axis motorized motion control, dual-channel heating technology, MES port, smoke purification system
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